hi,

this is a little far out, but hey, it's brainstorming time without a brain.  could this be a ground or power pin?  the reason i'm asking is this:  there may be an electrochemical reaction taking place, because of an inadequate cleaning step that this component is seeing prior to assembly.

phil

-----Original Message-----
From: Kevin Stokes [mailto:[log in to unmask]]
Sent: Friday, February 16, 2001 5:33 AM
To: [log in to unmask]
Subject: [TN] Wetting issues...



Everyone,

I'm having an interesting problem with fall out from production.  There is one leg on one component in one position (with others of the same component with no problem) that appears to have a wetting problem.  However, the fillets are well formed (not beaded up).  There is a crack under the solder pad, though.  Also, the solder has a flaky appearance.  If you are interested, I could send a picture of the joint directly to your email, let me know.  We've had about 10 failures in production with one field return already.

Thanks,

Kevin

Kevin Stokes
Reliability Manager
Kimball Electronics Group
[log in to unmask]
(812) 634-4207

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------