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Subject:	Re:
From:	Pamela Dugdale <[log in to unmask]>
Reply To:	Leadfree Electronics Assembly E-Mail Forum.
Date:	Thu, 1 Feb 2001 01:27:01 -0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

Hi Nick,

I've done quite a lot of work on this and there seems to be no obvious solution especially for larger devices (D-pak, D2-pak and bigger). Many of the smaller devices already use silver filled epoxy so should be OK. Unfortunately there are difficulties in transferring this technology to larger die, due to die-crack and die attach fatigue issues.

If anybody has more positive results for 'large' area die-attach I'd be very interested.

Kind regards,

Pam.

Dr. Pamela Dugdale
Assembly R&D Group
International Rectifier GB



>>> "Lalena, Nick" <[log in to unmask]> 01/31/01 07:09pm >>>
Has there been a Pb-free replacement solder developed for power die attach
applications?  This would replace the Au-Sn, Au-Si eutectic alloys or the
high-Pb (90-95 wt%Pb) solder.

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Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
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