Is it possible for up-loading workshop presentation materials onto some
public web, so that those who cannot attend can also access them?
Kind Regards,
Han JiangBo
********************************************
Principal Engineer, Ph.D.
Hardcopy Electronics Operation
Agilent Technologies Singapore
2 Corporation Road #05-01
Corporation Place
Singapore 618494, SINGAPORE
Tel. +65 215 4703
Fax. +65 268 4842
Email. [log in to unmask] < mailto:[log in to unmask]
<mailto:[log in to unmask]> >
********************************************
-----Original Message-----
From: Bob Willis [mailto:[log in to unmask]]
Sent: Thursday, February 01, 2001 3:07 PM
To: [log in to unmask]
Subject: Re: [LF] Workshop on Modeling and Data Needs for Pb-free Solders
Following your email may I suggest you may like to contribute to the UK
Interactive Lead Free Cookbook CD ROM produced by the NPL.
We like to cover all the groups in the world conducting lead free projects.
Bob Willis
Electronic Presentation Services
2 Fourth Avenue
Chelmsford Essex CM1 4HA
England
www.bobwillis.co.uk <http://www.bobwillis.co.uk>
Tel: (44) 01245 351502 Fax: (44) 01245 496123
----- Original Message -----
From: Carol Handwerker <mailto:[log in to unmask]>
To: [log in to unmask] <mailto:[log in to unmask]>
Sent: Wednesday, January 31, 2001 8:54 PM
Subject: Re: [LF] Workshop on Modeling and Data Needs for Pb-free Solders
The following announces an upcoming workshop on modeling and data needs for
Pb-free solders, sponsored by NEMI, NIST, NSF, and TMS. We welcome your
participation.
****************************************************************
Announcement
Workshop on Modeling and Data Needs for Lead-Free Solders
Sponsored by NEMI, NIST, NSF, and TMS
Thursday, February 15, 2001
8:30am - 4:30pm
New Orleans Convention Center, Room: Riverside R02
New Orleans, LA
The worldwide movement in the electronics industry to implement lead-free
solders has created a need for fundamental data that accurately describe the
behavior of these alloys in solder joints and can be used to develop
appropriate reliability models. The NEMI Lead-free Task Force and the
National Institute of Standards and Technology (NIST) are working together
to gather into a single database existing physical and mechanical property
data that have been developed by researchers around the world. As part of
this activity, we have developed a preliminary list of missing high priority
data for the Sn-Ag-Cu alloys selected by NEMI companies as the new standard
alloys for reflow and wave soldering. Considerable data, particularly with
respect to mechanical properties, is still needed.
The goal of this workshop is to bring together modelers and
experimentalists to:
********define the state-of-the-art in reliability modeling and mechanical
property measurements of lead-free solders;
********determine the "necessary and sufficient" experimental data modelers
need;
********describe the changes needed to improve modeling and data, including
failure criteria;
********develop a consensus on the best test methods for collecting needed
data; and
********complete the assessment of missing high priority data.
It is hoped that the workshop report describing our community's scientific
needs will serve as a roadmap for research in the reliability of lead-free
solders. Although NEMI is not a source of research funding, we may serve to
support funding of university and government labs in these areas by
communicating with the appropriate funding agencies the relevance of this
research to electronic industry needs and our willingness to collaborate in
fulfilling such needs.
If you are interested in attending and would like to register or would like
additional information, please contact Linda Jessup at NEMI, 703-834-2086,
or [log in to unmask] There is no registration fee.
Hotel information can be obtained at
http://www.tms.org/Meetings/Annual-01/AnnMtg01Home.html
<http://www.tms.org/Meetings/Annual-01/AnnMtg01Home.html>
For additional information on the NEMI Lead-Free Task Force, see
http://www.nemi.org/PbFreePUBLIC/index.html
<http://www.nemi.org/PbFreePUBLIC/index.html>
For additional information on the NIST Solder Program, see
http://www.metallurgy.nist.gov/techactv1999/AnnualReport1999.html#packaging
<http://www.metallurgy.nist.gov/techactv1999/AnnualReport1999.html#packaging
>
________________________________________________________________________
Workshop on Modeling and Data Needs for Lead-Free Solders
Sponsored by NEMI, NIST, NSF, and TMS
New Orleans Convention Center, Room 240
February 15, 2001 - New Orleans, LA
8:30 Welcome - Review of workshop objectives. Preview of strawman test
methods - Carol Handwerker - NIST
8:45 NEMI Task Force Overview - Ron Gedney -NEMI- and Jasbir Bath -
Solectron
9:15 NSF Manufacturing Program - Delcie Durham - NSF
9:45 NIST Advanced Technology Program - Carol Handwerker -
10:00 Ahmer Syed - Amkor
Overview of Reliability Models and Data Needs
What are the various types of reliability models for
lead-free solders?
What is common in all of the reliability models available for lead-free
solders?
Are these models sufficient to describe the properties?
What data are needed for these models, for the modeling community?
If we collect the data that the modelers request, will it be
enough to make
accurate predictions of reliability?
10:40 Leon Keer - Northwestern University
Constitutive and Damage Accumulation Modeling
What data are needed for these models, for the modeling community?
If we collect the data that the modelers using request, will
it be enough to
make accurate predictions of reliability?
11:20 Chris Bailey - University of Greenwich
Manufacturing and Reliability Modeling
Interaction between manufacturing models and reliability
models
Sensitivity of reliability to solder joint shape and complex
stress states
12:00 Lunch - (not provided)
1:00 Darrel Frear - Motorola
Experiments needed to characterize solder joint behavior
What is the set of experiments needed to completely characterize solder
joint behavior as input into reliability modeling ?
Strengths and weaknesses in existing techniques
What improvements are necessary?
1:40 Alek Zublewicz - Motorola (in conjunction with Don Henderson
-IBM)
Experiments needed to characterize solder joint behavior
What is the set of experiments needed to completely characterize solder
joint behavior as input into reliability modeling ?
Strengths and weaknesses in existing techniques
What improvements are necessary?
Alek will emphasize microstructural information needed.
2:20 Discussion of Modeling and Data/Database Needs
2 breakout sessions - Ahmer Syed/Jasbir Bath and Darrel Frear/Carol
Handwerker)
3:00 Break
3:15 Continued: Discussion of modeling and data/database needs
4:00 Reports from breakout sessions - define needs and opportunities;
action items
4:30 Adjourn
At 09:09 AM 01/30/2001 +0000, you wrote:
>I've been speaking to John Lynch at ON Semiconductor and we wondered about
>the industry's requirements for metrology.
>
>It would be interesting to note what parameters are of concern currently
and
>how they are measured - test type, machine, etc. It would also be
>interesting to see what parameters industry would like to measure, if it
>were possible. It might be that someone is using a test method in one part
>of the industry that someone else would like to use in another part.
>
>Perhaps we could get some consensus of opinion of what is important to
>ensure standards are reproducible and that processes are under control &
>maintainable globally. It may be that these could form the basis of an
>industry standard.
>
>If you can spare the time, could you please post your current test methods
&
>perhaps a short 'wish' list to this forum?
>
>Best wishes,
>Dominic Lodge
>ITRI
>
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**************************************
Carol A. Handwerker
Chief, Metallurgy Division
NIST
100 Bureau Drive Stop 8550
Gaithersburg MD 20899-8550
Office:(301) 975-6158
Fax:(301) 975-4553
e-mail:[log in to unmask]
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To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
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