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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 6 Feb 2001 16:51:25 -0600 |
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Education, education, education. I don't think there has been much of a voice from the component mfg'ing end concerning the limitations of the components in regards to standard assembly processing. Particularily as components get smaller and smaller. The component mfg'ers have focused on what the part can do but not so much on how to get the part placed so it can work, correctly.
Kathy
>>> [log in to unmask] 02/06/01 04:19PM >>>
I'm still down sizing pads to mount/solder chip devices. We had a
conversation about mounting 0603's on 0402 pad configurations last year. I'm
still going with that with some modifications. Anyone have anything else to
contribute concerning increased reliability as fewer end cap cracking
problems and solder joint failures? It all goes back to the early '80's as
LCCC's and related stuff with TCE mismatch problems.
Earl Moon
Proof Of Design
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