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February 2001

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Subject:
From:
Pat Kane <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Feb 2001 11:39:41 EST
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In a message dated 2/7/01 10:53:43 AM US Eastern Standard Time,
[log in to unmask] writes:

> Technetters,
>
> Does anyone have experience using the Temprobe thermocouples for profiling
> in a reflow oven? We have recently purchased 4 of these and after initial
> profiles were run, the profile plot showed very jagged lines compared to
> previous profiles run using "soldered-in" thermocouples.

Howard-
In regard to the "jagged " lines, I experienced in a past life that the use
of "temporary" probes exhibit this phenomenon if they are not attached to the
PCB in such a way that the movement of the conveyor isn't reflected in the
readout - indicating the temp probe is not maintaining constant contact with
the PCB surface.

my two cents worth

Pat Kane
CSL


> when using the same recipe and test points on the PCBA, the max rising
> slope and total time above had risen well above our standards. The lines
> on the graph for the four test points are relatively far apart.
>
> We are using a Vitronics XPM 820 ten zone oven in air, and the SlimKIC
> Transmitter/Data Logger. The thermocouple tips are carefully placed on
> the desired soldered leads of a soldered (previously) board. Did the
> solder with the soldered-in thermocouples inhibit the rate and amount of
> thermal energy transfer that much? Any suggestions or knowledge regarding
> the Temprobes will be greatly appreciated.
>
> Howard Watson
> AMETEK/Dixson
> ---

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