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Date: | Thu, 22 Feb 2001 14:47:24 -0500 |
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What: Florida IMAPS/SMTA Symposia
Where : Orlando FL, Four Points Sheraton
(3835 McCoy Road near Orlando International Airport)
When: March 20th
Looking for presenters,
session topic is "Chip Scale Assembly", and will cover PWB surface finishes,
solder paste, assembly, repair, and reliability issues.
Preview of presentations
* Process Optimization for 1.0 mm Pitch CBGA, Marie Cole, IBM
Microelectronics
* PWB Surface Finishes for CSP, Lee Parker , Via Systems
* Solderless connection, Frank Liotine
* Rework Process for Chip Scale Components, Don Naugler, SRT
Need to reply by 3/2/01
Please contact Tony Massini (727) 530-8168 or [[log in to unmask]] if you
have questions or are interested in presenting.
Thanks
Tom Obarski
Harris Corp.
Microsystems Technology Group
lab (321)727-6043, beeper (321) 690-4138
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