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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 16 Feb 2001 13:02:27 +0100 |
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Hallo David
We work with pumice jet scrubbing as Pretreatment before screenprinting
the soldermaks Coates imagecure XV 501 T i in vertikal
doublscreenprinting.
The next steps are electroless nickel-gold and sometimes chemcal tin.
We are very satsified with pumice jetscrubbing
We tested once micro Etchign with Sodiumpersulfatee and also brushing
but jet scrubbing with pumice was the best.
Spezially for the chemical tin you should use pumice jetscrubbing
with pumice but never microetch because you will have an lost of
adhasion because the chemistry will go under the soldermask
Best regards from Switzerland
Heinz
Heinz Mader
SLST Technologie PCB
Ascom AG
Belpstrasse 37 ,CH 3000 Bern 14
Phone: : 0041 31 999 37 04
Fax : 0041 31 991 82 53
MailTo: [log in to unmask]
Besuchen Sie unsere Homepage
http/www.ascom.ch/elektronik
"Albin, David" <[log in to unmask]>@IPC.ORG> on 16.02.2001
11:28:33
Bitte antworten an "TechNet E-Mail Forum." <[log in to unmask]>; Bitte
antworten an "Albin, David" <[log in to unmask]>
Gesendet von: TechNet <[log in to unmask]>
An: [log in to unmask]
Kopie:
Thema: [TN] Solder mask pre-clean
Gents & ladies of TechNet,
I would appreciate your assistance in a quick survey of
pre-clean
options prior to application of photoimageable soldermasks. If possible
could you send me your answers to the following questions:
1) What preclean system are you currently using (e.g., pumice, silicon
carbide brush, microetch)?
2) If microetch, what chemistry type (e.g., persulphate, ferric
chloride,
sulphuric/ peroxide, etc)?
3) Are there any plans to change the existing methods, and if so what
are
the drivers and what would you be changing to?
Any responses would be gratefully received!
Thanks in advance,
David Albin
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