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January 2001

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Subject:
From:
Jowan Iven <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Jan 2001 11:17:34 +0100
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Happy New Year to you all,

I'm currently looking for equipment to tape small batches of smd's.
There are two possible systems available 1) "Hot seal"   and   2) "Cold seal"
But I can't get a clear picture about all the pro's and con's.

I appreciate any input to make a more founded decision.



Jowan  Iven
Process  Engineer  Manufacturing
Stork Electronics

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