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January 2001

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Jan 2001 16:12:52 -0600
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Michael,

Check the Technet archives.  I think this was discuss in the last year or two.

Gary Camac

"Hiteshew, Michael" wrote:

> Hi,
>         I have a pcb design with two fine pitch through hole connectors. In
> order to route between pins on inner layers I need to remove unused inner
> layer pads on that connector.
>         Here's my question: from a production point of view, is it better to
> selectively remove only those pads necessary or remove all unused inner
> layer pads (or is there no difference?). This pcb will be manufactured IAW
> IPC-2222 class 3. It's operating environment will be 0 - 70 degrees C; no
> thermal shock anticipated.
>
> Michael Hiteshew
> Lockheed Martin NE&SS Marine Systems
> [log in to unmask]
> (410) 682-1259
>
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