I am not aware of a standard procedure or specification for PCB's however I
have had experience in the Thick Film hybrid area where a vacuum bake
process was used for moisture removal.  Typically 30 minutes at 125 c under
a minimum of 20 "/Hg was used.

Bill Christoffel

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of Ken Fong
Sent:   Tuesday, January 09, 2001 5:51 AM
To:     [log in to unmask]
Subject:        [TN] Water/moisture absorbed by rigid printed circuit boards

Dear Technetters,
Could anyone advise if there are any industrial practices/standards and
acceptance criteria about removing water/moisture absorbed during their
fabrication process in rigid pcbs such as FR1, CEM3, FR4 and etc before
their packing in the pcb fabrication company?
Thanks,
KenF

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