Let us look at the bond theory, and ask what is being done to the Copper
before the nomenclature ink is applied, and ask, can we do something there to
improve that bond.

I suspect the answer is yes. (Would I have written this if I thought
otherwise?)

I suspect that your analysis that the bond is being attacked is correct,
HOWEVER, I also suspect a better, stronger bond is achieveable, and not that
difficultly.

Ask, what are the processes that the Copper is seeing immediately prior to
legend ink application?

Would it be feasible to put another step immediately (and I do mean
immediately, no sitting around for a day+) prior to legend ink application.
A good cleaner, or perhaps a (very) mild microetch, would probably help the
ink bond dramatically.

Rudy Sedlak
RD Chemical Company

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