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Subject:	Re: Wave Soldering
From:	"d. terstegge" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 5 Jan 2001 18:19:05 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (44 lines)

Hi Trevor,
I'd say that the immersion depth for the regular wave should be around half of the boardthickness. This way there is enough static pressure, without flooding over the board-edges.
Immersion depth of a chipwave is more difficult (to define) because of the turbulence, but you could adjust it to the maximum height that doesn't result in solderballs. But for a well designed board you should put it a little lower.
I believe there's some useful wavesoldering setup information on Bob Willis's site (www.bobwillis.co.uk).

Kind regards,

Daan Terstegge
SMT Centre
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> Trevor Goddard <[log in to unmask]> 01/05 5:03 pm >>>
A quick question for you wave solder experts out there.
 Where is a good place to start in regards to immersion depth for the chip
wave and the regular solder wave?
Thanks in advance
Trevor Goddard,
SMT Supervisor
XLTEK
(905) 829-5300 x 348
[log in to unmask] <mailto:[log in to unmask]>

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