Lisa,
Being in the pcb manufacturing, we have installed immersion tin as a final
finish surface.
As I suspect, with any immersion process such as tin, silver, gold,
soldermask and nomenclature
adhesion sometimes become bigger problems than the actual process itself. We
experienced
the same problems. Through many agonizing weeks of evaluation we have come
up with using
a predip prior to the application of LPI or legend, which consists of a
diluted version of
an oxide replacement bath. This chemistry contains adhesion promoters for
which gave us the
the ability to withstand IPC tape test.


Tony Steinke
Circuit Technologies Inc.
----- Original Message -----
From: Lisa Angle <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, December 21, 2000 3:45 PM
Subject: [TN] Nomenclature with Immersion Tin/Silver


> All,
> I was wondering how you go about putting nomenclature on copper surfaces
> and subsequently processing thru immersion tin or immersion silver without
> experiencing nomenclature peel?  I have of course thought of the
> alternative which is to process the boards thru immersion processes and
> subsequently nomenclature them, however, our current inks require a long
> cure time and very high temperature which artificially ages the finishes.
> Thanks.
> Lisa Angle
> Alternative Surface Finish Engineer
> Teradyne
>
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