Thank you Torben for you answer,but our stepplatingproblem is, when we plate without soldermask that means the hole copper surface with electroless
nickel gold

Sorry Heinz Mader

Ascom AG
Technology PCB
CH 3000 Berne
Switzerland

Tel 0041 31 999 37 04
fax 0041 31 991 82 53






TOE/Torben Osteraa <[log in to unmask]>@IPC.ORG> on 31.01.2001 10:44:42
Bitte antworten an "TechNet E-Mail Forum." <[log in to unmask]>; Bitte antworten an TOE /Torben Osteraa <[log in to unmask]>
Gesendet von: TechNet <[log in to unmask]>
An: [log in to unmask]
Kopie:
Thema: Re: [TN] electroless nickel gold stepplating problems


Heinz,

We use the same chemistry as you and
are also processing prior to soldermasking.

For some yet unknown reason , baking
the boards at 120 deg C for 1 hour has
solved the skip-plating problem here.


regards

Torben Osteraa
Printca AS

-----Original Message-----
From: Heinz Mader [mailto:[log in to unmask]]
Sent: Wednesday, January 31, 2001 9:17 AM
To: [log in to unmask]
Subject: [TN] electroless nickel gold stepplating problems


Hallo outhere in th big pcb world

We have a plating problem with PCB ,we plate full electroless nickel
gold ,that means without solder mask.
The problem is,.that from time to time we have stepplating of nickel
This happens only on two types of boards,others boards we plate the same
way and there it never happens stepplating.
We work mith the Ronamerse SMT-Process from Shipley

We have no problems with skip plating in selektiv nickel gold

I hope for good ideas

hopefull greetings from switzerland

Heinz Mader
Ascom AG
CH 3000 Berne
Switzerand

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