Hi all,

We build a board here that's been built here before, using the same
processes. It is  around 8" X 8" polyimide fab, that has two very large
352-pin CQFP's on it. One of the customer requirements is that these parts be
bonded to the board using Loctite 3615.
So we print paste, then dispense the epoxy, place the parts, and then
cure/reflow the assembly.

With this last build we've done, the customer is reporting that the CQFP's
are cracking during their thermal cycle and vibration tests. This has not
happened before.
Is it possible that we have gotten a suspect batch of parts? Has anybody else
ever run across this type of problem before?

Thanks!

-Steve Gregory-

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