TECHNET Archives

January 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Nancy Trumbull <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Jan 2001 07:19:14 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Good Morning,

Please look at 6.5 Other in IPC 610C page 6-20 
States: The conditions in this section are applicable to both supported and unsupported connections.
And yes there could be concern for the solder side ( secondary side )more than likely there is  a circuit on the solder side.
Nancy T.

>>> [log in to unmask] 01/26/01 02:15PM >>>
The IPC standard states that all clipped leads must either be reflowed or checked under 10X magnification. Is this just a standard for single sided boards? If you have a double sided board and a good fillet on the component side of the board and you clipped the leads on the solder side what would be the cause of concern if a joint is fractured on the solder side? 

[log in to unmask] 

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2