How would you control an assembly with a fractured solder joint and keep the integrity of the solder joint? The solder joint could easily continue to degrade and cause field failures.
Kathy
>>> [log in to unmask] 01/26/01 01:15PM >>>
The IPC standard states that all clipped leads must either be reflowed or checked under 10X magnification. Is this just a standard for single sided boards? If you have a double sided board and a good fillet on the component side of the board and you clipped the leads on the solder side what would be the cause of concern if a joint is fractured on the solder side?
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<DIV>How would you control an assembly with a fractured solder joint
and keep the integrity of the solder joint? The solder joint could
easily continue to degrade and cause field failures. </DIV>
<DIV>Kathy</DIV>
<DIV><BR>>>> [log in to unmask] 01/26/01 01:15PM
>>><BR></DIV>
<DIV><FONT size=2>The IPC standard states that all clipped leads must either be
reflowed or checked under 10X magnification. Is this just a standard for single
sided boards? If you have a double sided board and a good fillet on the
component side of the board and you clipped the leads on the solder side what
would be the cause of concern if a joint is fractured on the solder side?
</FONT></DIV>
<DIV><FONT size=2></FONT> </DIV>
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