Ingemar,

Sorry if I missed a point here but:

IMHO, you cannot judge nickle solderability
prior to immersion gold. One of the 'absolutes' about
ENIG processing is that you keep the time between nickel
gold as short as possible while still allowing for required
rinsing.

Whether or not it is possible to test the soldearbility
just for the sake of testing, I do not know. Nickel is
supposed to passivate quite rapidly, so you
cannot use it to ensure that only good boards are
gold plated

Torben Oesteraa
Printca AS

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