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January 2001

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Subject:
From:
김선동 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Jan 2001 13:44:11 +0900
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Let's help the poor girl!



-----Original Message-----
From: Joseph H.smith. [mailto:[log in to unmask]]
Sent: Friday, January 26, 2001 1:06 PM
To: [log in to unmask]
Subject: [TN] reliability


Hello
 i'm hyun-ju ,So (PCB  Manufacturer)

Our team are going to develop Build-up pcb
so i need a reliability test condition required to Build-up PCB
for example
1. Peel strength
2. Delamination
3. registration
....... ets

please help me

would you like to sen me a file about Build-up pcb ?

thanks

Best regard
hyun-ju ,So  from korea

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