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January 2001

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Subject:
From:
"Mcmaster, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jan 2001 15:20:56 -0800
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Harinder

This is a good one for the archives.  It's a topic that's been covered many
times in the past.  I recommend searching for "bak" to cover both bake and
baking.  You'll find a wide range of recommendations for time, temperature,
materials and surface finish.

> ----------
> From:         Harinder Jassal[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Harinder Jassal
> Sent:         Thursday, January 25, 2001 2:40 PM
> To:   [log in to unmask]
> Subject:      [TN] PCB Baking
> 
> Hi TechNetters,
>  
> Is there any standard (IPC or otherwise) that details the requirements and
> the process of baking bare PC boards prior to assembly?  It is standard
> practice to bake boards that have been stored in high humidity conditions
> for long periods. These boards will have absorbed moisture and will need
> drying before wave soldering to prevent outgassing.  This should not be an
> issue with surface mount boards that will be reflowed. Given that the
> baking process will accelerate pad oxidization, is there any good reason
> to bake SMT boards?
>  
> Harinder Jassal
> Manager, Manufacturing Engineering
> Aimtronics Corporation (Delta)
> Tel: 604-946-9666
> Direct: 604-940-5712
> Fax: 604-946-7611
> [log in to unmask]
>  
> 

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