TECHNET Archives

January 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jan 2001 17:47:00 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
In a message dated 01/25/2001 4:11:55 PM Central Standard Time,
[log in to unmask] writes:

> We are think of using leaded capacitors and forming them to make and use
>  them as SMD. Any idea where I can get the pad design for converted part.
>
>  re,
>  ken patel

Ken,

You're not going to reflow them are you? Don't think through-hole caps can
take the heat of reflow...

-Steve Gregory-

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2