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Subject:	Re: Conformal Coating BGA
From:	David Douthit <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 24 Jan 2001 18:59:09 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

Tony,

I believe you may have more problems than coating pumping/CTE. If you completely fill the gap
under the BGA it is reasonable to assume that that coating will not completely cure
(not enough exposure to air). Also, if you don't draw a partial vacume during cure
you can trap air under the BGA. This combination can create all sorts of problems.

D. A. Douthit

Tony Whitfort wrote:

> We are dip coating a product with a BGA part on it.
>
> I am concerned that the coating under the BGA may cause reliability
> problems due to thermal expansion.
>
> We are using a silicon based coating and the BGA part is a standard
> 1.27mm pitch.
>
>  Can anyone point me to some literature on this.
>
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