TECHNET Archives

January 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Jan 2001 19:32:16 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
In a message dated 1/24/01 5:34:15 PM Central Standard Time,
[log in to unmask] writes:

<< I need to place 16 QFP168 with 16mil pitch leads on the bottom side.
 I will am going to reflow both top and bottom.

 I feel that there should be enough surface tension to hold the parts onto
the bottom, but
 I thought I would get some confirmation on this.

 Thanks

 Scott >>

Hi Scott!

You should be okay as long as it's not a ceramic part, or something with a
heat-sink that adds a lot of weight, just a question, what's on the top?

-Steve Gregory-

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2