In a message dated 1/24/01 11:05:51 AM Eastern Standard Time,
[log in to unmask] writes:

<< has an OSP over the silver why bother with the silver?  Wouldn't less
interfaces
 between the component
 and trace be better? >>

For that matter, why not use immersion tin? Why bother introducing a third
metal into your solder joint?

Otherwise, the immersion silver -- as with most immersion processes -- is
reported to be more robust in multiple solder pass applications, has improved
shelf life and is somewhat less sensitive to marginal handling practices than
OSP.

Cheers!

Bob Lazzara
Tech Support
Circuit Connect, Inc.
(800) 560-9457

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