TECHNET Archives

January 2001

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Subject:
From:
Bill Christoffel <[log in to unmask]>
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Date:
Wed, 24 Jan 2001 08:49:04 -0600
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The "mixed technology" you speak of is basically how we build all of our
product hear.  We are using conductive epoxy for COB (wire bonded) then
solder reflow on the back side.   There are a lot of great conductive
epoxies in the market depending on the performance criteria you need.

Bill C.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Marsico, James
Sent: Tuesday, January 23, 2001 2:35 PM
To: [log in to unmask]
Subject: [TN] silver epoxy & solder coated parts


Hello, Technet...

Here is an unusual situation.  We have to assemble a surface mount assembly
using silver epoxy.  Some of the components will be solder coated.  I know,
don't bother asking... this is the way it has to be.  The good thing is that
this assembly is a prototype for bench-top laboratory use only.  There is no
harsh environment and needs to operate 1, maybe 2, years.  The question is
does anyone foresee any problems?  What happens when one mixes toe two
technologies?

Thanks,
Jim Marsico
EDO Electronic Systems Group
[log in to unmask] <mailto:[log in to unmask]>

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