Ken,

Is this a full or perimeter array?  Also, have the
boards been processed through the wave solder.  If so,
some internal joints could have experienced a partial
secondary reflow creating insufficient solder joints.
If you have a rework station, a closely monitored
profile for reflow and then retesting might give good
results.

Lisa Anderson

--- Ken Patel <[log in to unmask]> wrote:
> Werner,
> Package looks visual fine on the reflowed boards
> hence my comment. Perimeter
> joints visually look fine too. Per our test folks,
> it passes when they apply
> the thump pressure on the BGA. This package is TBGA
> package.
>
> re,
> ken patel
>
> -----Original Message-----
> From: Werner Engelmaier [mailto:[log in to unmask]]
> Sent: Monday, January 22, 2001 3:09 PM
> To: [log in to unmask]
> Subject: Re: [TN] Urgent...Open underneath the BGA
>
>
> Hi Ken,
> When you say "BGA package looks sturdy to handle the
> heat", what to you
> mean?
> BGAs with Cu heat spreader sure look sturdy, but can
> warp like potato chips
> when heated.
> Werner Engelmaier
>
>
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