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January 2001

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Subject:
Re: Urgent...Open underneath the BGA
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 22 Jan 2001 18:09:23 EST
Content-Type:
text/plain
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text/plain (16 lines) 
Hi Ken,
When you say "BGA package looks sturdy to handle the heat", what to you mean?
BGAs with Cu heat spreader sure look sturdy, but can warp like potato chips
when heated.
Werner Engelmaier

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