Guys,
We are having opens underneath the BGA. BGA package looks sturdy to handle
the heat, meaning looks like no warpage at component level. But, I have
concerns at the physical location of BGA as my board is not a perfect
rectangular. We have added break away tabs using mouse bite to make a
perfect rectangular board.

I know there were study done in the past about the BGA location on the
board. Any idea where I can get some info on recommended placement location
particularly on irregular shape board? Any help will be highly appreciated.

re,
ken patel

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------