DUT —Device Under Test. A DUT board is used in automated testing of integrated circuits. It is part of the interface between the chip
and a test head, which in turn attaches to computerized test equipment. The specific test equipment used will determine the value of the
controlled impedance required for the chip tester boards. Depending on which system it is designed for, one type of DUT board is used in
testing individual chips in a silicon wafer before they are cut free and packaged, and another type is used for
testing packaged IC 's.
Ref:http://personal.idcomm.com/childers/pcgl_ins.htm#D
ilknur Baylakoglu
On 19 Jan 01, at 18:31, ±è¼±µ¿ wrote:
> Anybodfy hear about "DUT " board?
> (Device Under Test or called LoadBoard) board with spec. 3mm thickness,
> 0.25mm drill and this kind of drill must filled with epoxy or filled with
> gold plating
>
> Please let me know what DUT board is for?
>
> Thanks
>
> johnnie
>
>
>
> ================== send from ======================
> Johnnie Kim
> SEP CO.,LTD.
> A.S.K BUILDING 6F,
> 975-11,YOUNGTONG-DONG PALDAL-KU,
> SUWON-SI, KYUNGGI-DO,KOREA
> Phone:+82-(0)31-206-6438 Telefax:+82-(0)31-206-6438
>
> E-mail : [log in to unmask] http://www.sep.co.kr
> ==================================================
>
> -----Original Message-----
> From: Guenter Grossmann [mailto:[log in to unmask]]
> Sent: Friday, January 19, 2001 6:15 PM
> To: [log in to unmask]
> Subject: [TN] Antw: [TN] Phase transistions in solder joints
>
>
> Sophia
>
> - Structure
> The solder will change its structure during operation: The lead phases are
> getting coarser, the tin domains don't change much ( I know Werner, we
> don't fully agree in this ). However, this will also occur at ambient
> temperature so I wouldn't care about that.
> - Properties
> The creep properties of solder are temperature dependent. This means at
> high temperature the material deforms easier. In this respect one could
> speak of weakening. This might be a problem if your board is in vertical
> position and you have heavy components soldered in SMT. But I would
> consider this rather hypothetical.
> - Intermetallics
> Yes they grow. However, the problem of rupture occurs with temperature
> cycles that are fast enough to bring enough shear stress in the
> intermetallics to break them.
>
> Best regards
>
> Guenter
>
>
>
> Guenter Grossmann
> Swiss Federal Institute for Materials Testing and Research EMPA
> Centre for Reliability
> 8600 Duebendorf
> Switzerland
>
> Phone: xx41 1 823 4279
> Fax : xx41 1823 4054
> mail: [log in to unmask]
>
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