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January 2001

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Subject:
From:
김선동 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Jan 2001 18:31:06 +0900
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text/plain (90 lines)
Anybodfy hear about "DUT " board?
(Device Under Test or called LoadBoard) board with spec. 3mm thickness,
0.25mm drill and this kind of drill must filled with epoxy or filled with
gold plating

Please let me know what DUT board is for?

Thanks

johnnie



================== send from ======================
Johnnie Kim
SEP CO.,LTD.
A.S.K BUILDING 6F,
975-11,YOUNGTONG-DONG PALDAL-KU,
SUWON-SI, KYUNGGI-DO,KOREA
Phone:+82-(0)31-206-6438   Telefax:+82-(0)31-206-6438

E-mail : [log in to unmask]   http://www.sep.co.kr
==================================================

-----Original Message-----
From: Guenter Grossmann [mailto:[log in to unmask]]
Sent: Friday, January 19, 2001 6:15 PM
To: [log in to unmask]
Subject: [TN] Antw: [TN] Phase transistions in solder joints


Sophia

- Structure
The solder will change its structure during operation: The lead phases are
getting coarser, the tin domains don't change much ( I know Werner, we
don't fully agree in this ). However, this will also occur at ambient
temperature so I wouldn't care about that.
- Properties
The creep properties of solder are temperature dependent. This means at
high temperature the material deforms easier. In this respect one could
speak of weakening. This might be a problem if your board is in vertical
position and you have heavy components soldered in SMT. But I would
consider this rather hypothetical.
- Intermetallics
Yes they grow. However, the problem of rupture occurs with temperature
cycles that are fast enough to bring enough shear stress in the
intermetallics to break them.

Best regards

Guenter



Guenter Grossmann
Swiss Federal Institute for Materials Testing and Research EMPA
Centre for Reliability
8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :      xx41 1823 4054
mail:     [log in to unmask]

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