Hello

I have been asked to define which type ( and why) of SMC termination material is
correct for soldering, or other means of mounting.

I am aware that nickel barrier, and nickel barrier tinned SMC's are only suitable
for soldering and therefore conductive silver epoxy resin mounting is unsuitable.

SMC's with silver, silver/palladium termination's are unsuitable for soldering and
tend to be used in hybrids and on ceramic substrates where they are bonded down
with silver epoxy.

Questions:
!/ Is what I have stated correct?
2/What documentation/reference's are there that state this?
3/What causes a termination material to be more suitable for a chosen means of
mounting?

Thanks for your help
Alan Peters
BAE SYSTEMS PLYMOUTH

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