We have a BGA product which is molded. Due to the constriction of system
where it is used, there is no air flow to the top of this package. We are
contemplating to attach a heat sink to the top of the package. However,
the major concern is that it may not be effective since the
thermal resistance of molding compound is high. We are not experts in heat
transfer area. Will attaching a heat sink be effective to dissipate heat
in this case?

Thank in advance,

Yuan Li

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