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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 22 Jan 2001 12:06:33 -0800 |
Content-Type: | text/plain |
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Guys,
We are having opens underneath the BGA. BGA package looks sturdy to handle
the heat, meaning looks like no warpage at component level. But, I have
concerns at the physical location of BGA as my board is not a perfect
rectangular. We have added break away tabs using mouse bite to make a
perfect rectangular board.
I know there were study done in the past about the BGA location on the
board. Any idea where I can get some info on recommended placement location
particularly on irregular shape board? Any help will be highly appreciated.
re,
ken patel
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