 
| Subject: | |
| From: | |
| Reply To: | Leadfree Electronics Assembly E-Mail Forum. |
| Date: | Fri, 19 Jan 2001 09:23:15 -0700 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
sorry not for abrasion specifically --- anyone interested in a wafer
strength test facility for those reducing wafer thickness and
simultaneously optimizing wafer grinding etching defects?
"Pielmeier, Norbert" wrote:
>
> Does anybody know an hardness test (abrasion test) for a plating thickness
> of 8 to 15 microns?
> (SN, or SnPb or SnWi)???
>
> Thanks norbert
>
> ---------------------------------------------------------------------------------
> Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------
---------------------------------------------------------------------------------
Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|
