DESIGNERCOUNCIL Archives

January 2001

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Subject:
High Freq Soldering
From:
Tom Parkinson - Quality System Manager <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Fri, 12 Jan 2001 12:51:20 -0500
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text/plain (19 lines) 
We are getting into sealing circuits with metal covers. The covers have
to be lap soldered in place on PCBs and assemblies.

J-STD-001-C says 3.1.2. Specialized Processes shall be performed in
accordance with documented procedures. The only thing the customer is
saying is they used a very large, very hot, soldering iron....

Are there any specifications for soldering in this type of application?

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