In a message dated 1/5/01 5:11:51 PM Eastern Standard Time, [log in to unmask]
writes:

<< Let us look at the bond theory, and ask what is being done to the Copper
 before the nomenclature ink is applied, and ask, can we do something there to
 improve that bond. >>

I'm confused (not an uncommon circumstance): Why are we putting legend ink on
copper? Typically the only areas relieved by solder mask are solderable
lands, and most PWB designers & fabricators go out of their way to ensure
legend ink IS NOT on these areas.

My original understanding was that there was legend ink peeling from solder
mask (and by-the-way, has the solder mask cure been validated?).

Bob Lazzara
Circuit Connect, Inc.

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