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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 5 Jan 2001 18:19:05 +0100 |
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Hi Trevor,
I'd say that the immersion depth for the regular wave should be around half of the boardthickness. This way there is enough static pressure, without flooding over the board-edges.
Immersion depth of a chipwave is more difficult (to define) because of the turbulence, but you could adjust it to the maximum height that doesn't result in solderballs. But for a well designed board you should put it a little lower.
I believe there's some useful wavesoldering setup information on Bob Willis's site (www.bobwillis.co.uk).
Kind regards,
Daan Terstegge
SMT Centre
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
>>> Trevor Goddard <[log in to unmask]> 01/05 5:03 pm >>>
A quick question for you wave solder experts out there.
Where is a good place to start in regards to immersion depth for the chip
wave and the regular solder wave?
Thanks in advance
Trevor Goddard,
SMT Supervisor
XLTEK
(905) 829-5300 x 348
[log in to unmask] <mailto:[log in to unmask]>
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