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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 11 Jan 2001 11:00:09 EST |
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In a message dated 01/11/2001 9:49:00 AM Central Standard Time,
[log in to unmask] writes:
> Steve,
>
> Ina very past life we produced a product similar. We were able to control
> the solder running and maintain the solder tension at the pad site by
having
> the trace necked down considerably (bare minimum width) to force and create
> as large a solder dam as possible.
>
> Kathy
Hi Kathy!
It looks like they've done that with some of the pads but not with all of
them. You can see what I mean by looking at a picture I've taken of a section
of the PCB. Go to:
http://www.driveway.com/share?sid=4eced0a4.94f42&name=Pictures&view=3
There you'll see the footprint for 4 components, a large cap, two 1206 parts,
and a 0805 part. I'm not sure if they necked down the traces to help with
soldering, but I still think I'm going to have a lot of problems if I try to
print paste and reflow...don't you?
Thanks!
-Steve Gregory-
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