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Tue, 2 Jan 2001 21:05:31 +0800 |
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base64 |
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text/plain; charset="utf-8" |
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Huawei Technology Co.,Ltd. |
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1.0 |
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Dear engelmaier,
Another question to distrub you:
As you recommand, IPC-D-279 Appendix A Table A-1 say thermal cycle use -40~85 dwell time is 12h to test a solder joint reliability of telecom product, but in Mil-std-883, it use a dwell of >10mins to cycle, which to choose when experiment&FEM simulate ? what different with them? and as use IPC-D-279 recommanded, the test will be too long(a day/cycle), how we can do?
Best Regard,
Liu changkang
Huawei Technology Co., Ltd.
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