TECHNET Archives

December 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 12 Dec 2000 04:49:45 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
Steve,

As I said in another correspondence, to assure solder wetting, we "tin" wire
"tips" (the area of the wire exposed after stripping the insulation). The
"tinning" process really is stripping, dipping the exposed copper in the
specified flux, then dipping the wire into a small solder pot. Again, one of
the big things is not letting the solder wick up under the insulation.
Another is assuring the wire wets the exposed copper and it is the length
required to wrap around the terminal or be inserted into connector cups.

Unless I'm missing something, what's the point of "plating" the wire? Please
let me know.

Earl

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2