With Electroless NI underneath, presumably.

We assume that the boards were processed in a normal manner, and went
directly from Electroless Ni to Gold, with no time elapsing between to allow
passivation of the EN?  (This might explain differences on the same panel)

And we assume the Gold bath was running properly, appropriate pH, metal
level, etc?

The problem probably originated in the EN, however, if preclean before EN was
questionable, this could have caused the problem.  Even developing (of the
soldermask) can create problems, if it is not done properly..and the problems
in developing will not show until EN and Gold are applied.


Rudy Sedlak
RD Chemical Company

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