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Subject:	Re: Re-sealing Moisture Sensitive Components
From:	Jack Crawford <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 7 Dec 2000 17:48:09 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

Rick, please check IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices.  Hard copies are available through IPC Customer Service 847.790.5362.  Jack

==========================================
APEX - the industry's premier trade show in Electronics
Manufacturing, January 16-18, 2001, San Diego, California.
More information on website www.apex2001.org
--------
Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask] 
847-790-5393
fax 847-509-9798

>>> [log in to unmask] 12/07/00 04:21PM >>>
I need some opinions on re-sealing moisture sensitive components.  Like many
places, we have a procedure covering the handling of moisture sensitive
devices.  It includes provisions for re-sealing opened bags of components
with dessicant, etc.  Recently our manufacturing manager has been allowing
the use of the metalized anti-static bags used for PCBA packaging to be used
to seal components instead of the heavier metalized bags the components
originally come in.  I don't believe this is sufficient protection, but I'd
like opinions either way.  Am I over reacting or should we not allow this
type of bag for re-sealing devices?

Thanks in advance,


Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask] 

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