TECHNET Archives

December 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ernie Crump <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Dec 2000 15:57:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
Lou;  We don't run a large quantity of cca's through our machine, but with pwb's
solder masked over tin/lead, we don't see much movement in the copper reading.
Always around .075%
I find it wise  every so often to do several tests at an independant lab on the
solder from the bath, and in several cases on the bar stock received, which is
to the QQ-P spec.
One phenon. I find strange is the need to add tin fairly regularly, we can drop
1% in a short time, with very little soldering being processed. Less than 100
6x8 " boards.
Your case may have to do with the use of bare copper runs, even with smobc.
   Ernie Crump

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2