Hann,

Help me out here.  By underfill do you mean an application of an RTV or is
it some other process?

Hans

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Process Engineer
Toppan Electronics, Inc.
770 Miramar Road
San Diego, CA 92126
(858) 695 - 2222 ext. 241
(858) 695 - 6823 fax
[log in to unmask]


-----Original Message-----
From: Hann Pang [mailto:[log in to unmask]]
Sent: Tuesday, December 05, 2000 9:27 AM
To: [log in to unmask]
Subject: [TN] Query: industry standard for pretreating PWB/PCB before
underfilling?


Hi
Can someone help me with the question??  Thank you very much.

I'm posting the above question as a technical marketer for 3M.  We're
currently working on underfills and the question is posed in consideration
of the outgassing of the PCBs.
If there is'nt a standard, then the next question is; typically, what are
the pretreating conditions if there is any pretreating at all?

Thanks and regards,

Hann Pang
Technical Markerter

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