TECHNET Archives

December 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Dec 2000 10:43:15 -0600
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (1330 bytes) , TEXT.htm (1903 bytes)
Hope this helps.  Have both terminations enter the wave at the same time because of thermal shocking.  You will see large cracks in the ceramic material but I have only experience funstion failures due to the cracking when at a capacitance of .1 uf in a 0805 package.  Also monitor for time over the wave and density.  This package is common for being sucked off of the PCB due to the solder tension. 

Kat

MEXTECH.COM 12/05/00 10:32AM >>>
It seems like I remember something about a problem wave soldering 1210 chip
caps (ceramic). I've been searching the archives for this subject but was
unsuccesful. Does anyone have any information on this as a problem?

Thank you,
Ken Bloomquist
PRIMEX Aerospace Company
www.primextech.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------


ATOM RSS1 RSS2