Hi Michael,
For appropriate accelerated reliability tests go to documents IPC-SM-785,
Guidelines for Accelerated Reliability Testing of Surface Mount Solder
Attachments, for performance qualification use IPC-9701, Performance Test
Methods and Qualification Requirements for Surface Mount Solder Attachments
(currently in Official Proposal form), and for good reliability design
IPC-D-279, Design Guidelines for Reliable Surface Mount Technology Printed
Board Assemblies.
'Bump pull' tests and the like only confirm quality, but do not assure
reliability.
Werner Engelmaier

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------