I am trying to determine the standard reliability tests for BGA
assemblies and would like someone to point me in the right direction.
In particular I am interested in the tests for solder bump integrity -
should they have a particular shear strength? - how many thermal cycles
must they survive? - is there a 'bump pull' test and criterion? etc..

Thanks

Michael

Michael McInerney
Rose-Hulman Institute
Terre Haute, IN.

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