Happy Holidays people... hope things are going well for everyone...

I have some questions regarding lifted resist problems, our Process
Engineer is quite convinced we have a resist lifting problem due to the
double-treat and drum-treat laminates we purchase.

What we have been seeing are very isolated areas of resist lifting after
developing, areas down space lengths around 50 75 mils long. I have not
seen any total separation from the copper but I have seen lifted edges,
again, in very isolated areas, typically not more than 1 instance per
panel, and then only on appr 10% - 15% of the total panel lot.

We identify this at AOI prior to etch.

I don't have the camera here or i'd snap a few pics for you, even then I
don't think it'd turn out well as they are very small areas.

Anyway, I find it hard to believe contaminates on foil, responsible for
lifting resist can occur in such minute areas and so infrequent
throughout the lot.

Any assistance would be appreciated, thanks

Franklin D Asbell
Network Circuits
Irving, Texas ~tucking the Cowboys banner down under the desk, out of
sight, grin~

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------