TECHNET Archives

December 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Russell Burdick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Dec 2000 10:14:54 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Dear Technetters:

Can anyone provide some basics as to pulse plating of acid copper. General
equipment needs and advantages compared to constant plating of same.

Thanks in advance.

Russell Burdick
Process Engineer, Mosaic Printed Circuits
_________________________________________________________________
Get your FREE download of MSN Explorer at http://explorer.msn.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2