TECHNET Archives

December 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Dec 2000 08:07:44 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (104 lines)
The qual will be more specific to how the finishes function in our processes
and ultimately must be presentable to our customers.

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]


> -----Original Message-----
> From: David Hillman [SMTP:[log in to unmask]]
> Sent: Thursday, December 21, 2000 5:21 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] immersion silver and tin qual
>
> Hi Ryan! There has been a tremendous amount of published data on both
> immersion tin and immersion silver qualification in the last two years.
> The
> APEX 2000 proceedings, the last two IPCWorks proceedings (1999, 2000), and
> the IPC Irvine Surface Finishes conference proceedings (1999) would be 4
> sources I know which contain papers. Are you planning on conducting basic
> qualification testing or something more specific to how the finishes
> function in your processes?
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
>
> Ryan Grant <[log in to unmask]>@IPC.ORG> on 12/20/2000 09:38:19 AM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> respond
>       to Ryan Grant <[log in to unmask]>
>
> Sent by:  TechNet <[log in to unmask]>
>
>
> To:   [log in to unmask]
> cc:
>
> Subject:  [TN] immersion silver and tin qual
>
>
>         Hi All,
>
>         I've just been given an open ticket to conduct a surface finish
> qual
> for immersion silver and immersion tin.  Anybody have suggestions about
> what
> aspect of the finish to test?
>
>         The surface will be used at SMT, thru-hole, press fit, and ICT
> (test
> points).  (No wirebonding or contacts).  Edge plating may be necessary for
> certain designs that ground the board to the chassis by sliding the board
> into fingered slots.
>
>         We are looking for a replacement of immersion gold, but don't want
> to deal with the assembly issues with HASL or OSP.
>
>         What I would like most is maintaining solderability WITHOUT taking
> special precautions.  (At least, no more than must be done with gold).
>
> Thanks
>
> Ryan Grant
> Advanced Technology Engineer
> MCMS
> (208) 898-1145
> [log in to unmask]
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> -------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2